Pack&Strat Software

PACK & STRAT: Packaging fast by Stratoconception

From a CAD model or a scatter plot from the scanning of the product, Pack & Strat® software offers:
The automatic design of the virtual counter-form intended to house or to fix the product,
- The slicing of this counter-form,
The automatic generation of the 2D or 3D cutting paths of each of these wafers in the retained material.
These different layers thus produced are positioned and assembled together by means of inserts, or directly, thanks to an outer packaging (American box).
Stratoconception® is the original process developed and patented internationally since 1991 by the CIRTES
Stratoconception®, Pack & Strat® are registered trademarks of CIRTES



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